The low-pressure injection molding process is a packaging process that uses a very low injection pressure to inject a hot melt material into a mold and quickly cures it. It achieves insulation, temperature resistance and resistance with excellent sealing properties and excellent physical and chemical properties of Henkel hot melt materials. Impact, vibration, moisture, water, dust, chemical corrosion, etc., play a good role in protecting electronic components. Compared with traditional potting processes (such as two-component epoxy or silicone potting), Henkel's low-pressure injection molding process is not only environmentally friendly, but also greatly improved production efficiency can help reduce the total cost of production.
Advanced features of low pressure injection molding process:
Low injection pressure
It can package fragile/fragile originals without damaging the components.
increase productivity
No chemical reaction, using one-component materials. The process is simple, clean and has a short cycle time (only a few to a few tens of seconds).
Excellent material properties
Physical protection performance: waterproof, moisture-proof, electrical insulation, buffering.
Chemical resistance: resistant to gasoline, solvents, oil, ethanol, acid, alkali corrosion.
Flame retardant properties: UL94V-0 certified.
High and low temperature stability: heat cycle, low temperature resistance, high temperature resistance (-40 ° C to 150 ° C).
Environmental protection: Does not contain any toxic substances, is RoHS compliant and can be recycled.
Reduce total production costs
The carrier box that must be used in the potting process is eliminated.
No heat curing, energy saving.
In the case of PCB packaging, the amount of packaging material used is greatly reduced compared to the potting process.
Aluminum molds reduce mold costs.
Three typical applications for low pressure injection molding processes:
Printed circuit board (PCB)
Low pressure during the injection molding process prevents damage to sensitive electronic components. This material protects the electronic device from external environmental influences (such as moisture, mechanical stress, etc.) and can act as a housing.
Connector waterproof seal
Seal the plug and cable clamp with hot melt material.
On-site injection molding of grommet
This low pressure injection molding process can be used to make the grommet on site. Overcome the time spent in the process of wearing the grommet and improve the production process.
